SEI High Yield Bond & Alternative Credit ETF Distribution Date & History
SEI High Yield Bond & Alternative Credit ETF (LEND) is tracked as a US ETF or fund. No future ex-dividend date is currently announced. The page separates event payout yield from trailing annual yield and leaves unannounced values blank.
Next ex-dividend date
Not announced
Next payment date
Not announced
Next amount per share
Not announced
Trailing annual yield
1.55%
LEND distribution history
Inferred frequency: Monthly
| Ex-date | Payment date | Amount/share | Event yield | Source |
|---|---|---|---|---|
| 2026-08-05 | 2026-08-06 | $0.141 | 0.57% | Nasdaq |
| 2026-07-06 | 2026-07-07 | $0.245 | 0.98% | Nasdaq |
LEND distribution FAQ
When is the next LEND ex-dividend date?
A future LEND ex-dividend date has not been announced in the collected calendar data.
How much is the next LEND distribution?
The next payout amount is not announced in the collected data. OneDayTrading does not estimate unannounced payouts.
How often does LEND pay distributions?
Monthly is the cadence inferred from the available event history. It is descriptive, not a promise of future payments.
Is the LEND yield guaranteed?
No. The displayed trailing yield uses past cash payments and a recent market price. Future distributions and market prices can change.
Data sources: Nasdaq dividend calendar and Yahoo Finance market enrichment. Last data update: 2026-09-01 05:49:34 KST. Information is not investment, tax or legal advice. Issuer announcements and broker records control.